defence exam CRPF ASI Technical Mock Test 2023 Electronic Devices Device Technology

Selectively removing unwanted material from the surface of the wafer is referred to as:

1

Lithography

2

Oxidation

3

Etching

4

Diffusion

Share: WhatsApp Telegram X

Sponsored

hivanix.in

This quiz is brought to you by hivanix.in

🌐 Web App Development

Other Tools: chatwiz.hivanix.in mmspace.hivanix.in unogame.hivanix.in

Quick Navigation

Home

Subjects

Chapters